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SYSTEM IN PACKAGE (SIP)
System in Package (SiP) is the processing of sensitive bare dies or chips into
robust finished modules or components. With 20 years of experience, Swissbit
successfully uses advanced packaging technologies in order to achieve the
smallest form factors built into Multi-Chip-Packages. With this microelec-
tronic integration approach our products provide more functionality and
highest memory densities inside one package. Various functional blocks
(RF, digital, sensors, security and memory) can be combined, as well as
passive components in a single package.
Beginning with the wafer and bare die handling, Swissbit utilizes a flexible
chip on board (COB) assembly and packaging line. Processes like SMT assem-
bly, die bonding, Au and Al wire bonding, glob top dispensing, under fill,
molding, precise singulation with laser technology, housing, labeling,
laser marking, tampon printing etc. are very well established.
Swissbit has extensive expertise in die stacking and the integration of addi-
tional hardware features, especially for Flash and DRAM devices. An internal
Memory-In-Package line positions Swissbit as a development and production
partner for dedicated or customized memory based products that have
challenging integration and reliability requirements. If customers require
additional resources for designs that have special space or performance
demands, Swissbit has experienced teams of design, test, and quality
engineers along with project managers to provide feasibility studies or
manage entire development projects. In-house prototype, small, and mid-size
assembly lines allow volumes up to 50,000 pieces per month. Swissbit will
provide support from the inception of a project, through design phase,
prototyping, circuit layout and material selection, to providing the proper
packaging for storage and transport.
TECHNOLOGY COMPETENCE
29
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